New hinged combo SIM / Micro SD socket

Engineers designing for high vibration environments will value the MES3055 hinged connector which allows full retention of both the SIM and µSD cards in demanding handheld and mobile applications. The connector also allows engineers to design more reliably for dust-laden or damp environments as the cards can be sealed inside the final product not allowing ingress of moisture or dust. The MES3055 is fully qualified to relevant MIL and EIA standards and will withstand a 50G shock without loss of electrical connectivity.

MES3055 Data Sheet     MES3055 Spec Sheet     Request Free Samples

Available in tape-and-reel packaging for volume manufacturing the MES3055 offers excellent coplanarity of +/-0.05mm while withstanding IR reflow at temperatures up to 260°C.

2.90mm profile Hinged 8 pin Micro SD and 8 pin SIM combo connector With locating peg Durability: 5,000 cycles

Free samples are available now; visit the GCT website at www.globalconnectortechnology.com or contact your local GCT Sales Office.